TECHNOLOGY AREA(S): Electronics, Materials/Processes, Weapons

ACQUISITION PROGRAM: FNC JS-EMW-FY17-01 High Reliability DPICM Replacement (HRDR)

The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), 22 CFR Parts 120-130, which controls the export and import of defense-related material and services, including export of sensitive technical data, or the Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls dual use items. Offerors must disclose any proposed use of foreign nationals (FNs), their country(ies) of origin, the type of visa or work permit possessed, and the statement of work (SOW) tasks intended for accomplishment by the FN(s) in accordance with section 5.4.c.(8) of the solicitation. Offerors are advised foreign nationals proposed to perform on this topic may be restricted due to the technical data under US Export Control Laws.

OBJECTIVE: Develop and demonstrate packaging and assembly techniques that can be utilized for the integration of MicroElectroMechanical Systems (MEMS) with energetic materials and are scalable for high-volume production applications.

DESCRIPTION: MEMS are an emerging technology that are the focus of several efforts to develop miniature Safe and Arm (S&A) and sensor prototype devices for Navy and Marine Corps munitions. These efforts include the integration of MEMS components and energetic materials (explosives and propellants) to produce devices that can be directly integrated into munition fuzing systems. These devices must be packaged in a way that ensures the long-term survivability and reliability of the microscale mechanical and energetic components. The packaging techniques utilized must also be scalable and compatible with high-volume manufacturing techniques capable of affordably producing thousands to millions of devices in a parallel fashion.

The work proposed in this topic involves developing and demonstrating techniques that can be used to package micro energetic components (sub-millimeter to millimeter scale) that have been integrated with silicon-based MEMS devices. Work should focus on wafer to wafer alignment and bonding, post-bonding die singulation, and handling, alignment and assembly of explosive components (pellets) utilizing methods such as pick and place.

The packaging and assembly techniques developed must be compatible with explosive materials. Explosive compatibility includes limiting bonding temperatures to 150 ºC or less or applying localized heating techniques if temperatures that exceed 150 ºC are utilized. Minimizing environmental stimuli, such as electrostatic discharge (ESD), shock, and vibration during component handling is also critical. While various low temperature wafer bonding techniques have been developed in academia and industry, none have been reported to have been demonstrated with energetic components. The developed techniques should also be compatible with sensitive MEMS components such as low-stiffness spring-mass systems (accelerometers and g-switches) so that stiction and other mechanical damage is not induced during packaging.

PHASE I: Define and develop conceptual techniques for energetic component handling and placement, wafer alignment and bonding, and die singulation. Perform modeling and simulation to determine heat transfer to energetic components and stresses induced on MEMS components due to packaging. Feasibility/proof of concept shall be established during the Phase I base using modeling and simulation and/or other experimental techniques. During the Phase I Option, if exercised, design test structures and produce wafer layouts for devices that can be fabricated for complete concept feasibility and tested in Phase II.

PHASE II: Fabricate test wafers based on layouts produced in Phase I in quantities sufficient to demonstrate and validate the proposed component handling and packaging techniques. Determine the effectiveness of the proposed techniques by assembling prototype packages and subjecting the packages to testing that validates bond strength, integrity, and hermeticity and proper post-assembly MEMS component performance. Analyze test and evaluation results and recommend go-forward assembly techniques that can be used to produce prototypes in higher volumes during a possible Phase III project continuation. Deliver limited test devices to the government for additional testing and inclusion in munition subsystems.

In the Phase II base, techniques can be initially demonstrated on an individual chip level or with partial wafers if it can be proven that they can be readily scaled to a wafer level with a high degree of confidence. Initial assembly trials can also be performed with inert simulants instead of energetic materials if it can be demonstrated the developed processes can be utilized with energetic materials with a high degree of confidence. During Phase II Options, if awarded, the developed techniques should be demonstrated on the wafer level with tactical energetic components.

PHASE III DUAL USE APPLICATIONS: Build upon packaging and assembly techniques developed and demonstrated throughout Phases I and II in order to demonstrate that packages can be reliably produced in high volumes. Deliver MEMS S&A packages that are suitable for integration into the JS-EMW-FY17-01 FNC program and a TBD follow-on acquisition program. Private Sector Commercial Potential: The developed techniques will be applicable to any MEMS devices that contain energetic materials, heat sensitive components, or otherwise contain delicate components that require low-temperature assembly techniques. Examples could include ignition safety devices (ISD) for commercial rocket motors or detonators for automobile air bags, mining, and demolition.

REFERENCES:

• Joon-Shik Park, Yeon-Shik Choi, and Sung-Goon Kang, “Silicon to Silicon Wafer Bonding at Low Temperature Using Residual Stress Controlled Evaporated Glass Thin Film,” Materials Science Forum, Vols. 510-511, (2006), pp 1054-1057.
• MASAYOSHI ESASHI, AKIRA NAKANO, SHUICHI SHOJI and HIROYUKI HEBIGUCHI, “Low-temperature Silicon-to-Silicon Anodic Bonding with Intermediate Low Melting Point Glass,” Sensors and Actuators, Vols. A21-A23, (1990), pp 931-934.
• JWei, H Xie, M L Nai, C KWong, and L C Lee, “Low temperature wafer anodic bonding,” Journal of Micromechanics and Microengineering, Vol. 13, (2003), pp 217–222.
• Hsueh-An Yang, MingchingWu, and Weileun Fang, “Localized induction heating solder bonding for wafer level MEMS packaging,” Journal of Micromechanics and Microengineering, Vol. 15, (2005), pp 394–399.
• Park, J-S. and Tseng, A. A, “Development and characterization of transmission laser bonding technique,” Proceedings of IMAPS Int. Conf. Exhibition Device Packaging, (2005.)

KEYWORDS: MEMS; Wafer Bonding; Packaging; Energetics; Fuze; S&A; ISD; Hermetic

** TOPIC AUTHOR (TPOC) **

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