S-Band Transmit/Receive Module for Airborne Navy Radars
Navy SBIR 2018.1 - Topic N181-006
NAVAIR - Ms. Donna Attick - email@example.com
Opens: January 8, 2018 - Closes: February 7, 2018 (8:00 PM ET)
TECHNOLOGY AREA(S): Air
ACQUISITION PROGRAM: PMA 231
E-2/C-2 Airborne Tactical Data System
The technology within this
topic is restricted under the International Traffic in Arms Regulation (ITAR),
22 CFR Parts 120-130, which controls the export and import of defense-related
material and services, including export of sensitive technical data, or the
Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls
dual use items. Offerors must disclose any proposed use of foreign nationals
(FNs), their country(ies) of origin, the type of visa or work permit possessed,
and the statement of work (SOW) tasks intended for accomplishment by the FN(s)
in accordance with section 5.4.c.(8) of the Announcement. Offerors are advised
foreign nationals proposed to perform on this topic may be restricted due to
the technical data under US Export Control Laws.
OBJECTIVE: Develop an S-band
transmit/receive (T/R) module suitable for use in a next-generation Navy
DESCRIPTION: The Navy
currently needs an S-band transmit/receive (T/R) module with sufficient power
density to make an airborne 360-degree electronically-scanned array (ESA)
viable as a functional surveillance asset. The current state of the art T/R
modules lack sufficient power density to obtain the desired Equivalent
Isotropically Radiated Power (EIRP). Novel ways are sought in order to
increase power density to a usable level. The resulting
solution should be ruggedized to meet military avionics requirements including
but not limited to: MIL-STD-704F (power), MIL-STD-461F (electromagnetic
compatibility), and MIL-STD-810G w/ CHANGE 1 (environmental: temperature,
altitude (45,000 ft), salt mist, explosive atmosphere vibration, shock,
aircraft carrier catapult launch and arrested landing).
PHASE I: Design, develop, and
demonstrate a top-level concept for an S-band T/R module design that meets the
criteria listed in the Description. Address lifecycle support for the T/R
module early to ensure a T/R system that is realizable, manufacturable, and
maintainable. Identify and/or model parts deemed critical to the effort if
possible. Develop plans for delivering a breadboard prototype in Phase II.
The environmental requirements for the E-2D radar will be provided.
PHASE II: Based on the
results of Phase I, develop two prototype (i.e. brassboard) T/R modules for
evaluation, as well as any unique support electronics. The prototypes should
be consistent with the top-level architecture, continue to advance the design
in accordance with host platform radar system definition, and host airframe
capabilities and limitations data that will be provided by the Government.
Support the development of a preliminary T/R module design document that
captures the prototype architecture.
PHASE III DUAL USE
APPLICATIONS: Codify system definition via a formalized system readiness review
(SRR), to be followed by formal design review events. Produce T/R modules and
support electronics advanced development models (ADMs) in quantities sufficient
for qualification testing in both laboratory and airborne testing environments.
These tests will include shock, vibration, temperature, Salt Mist, Cats &
Traps, and humidity levels typical of an aircraft carrier operational
environment. Develop and document production processes. The U.S. domestic
Radio Frequency (RF) semiconductor market supplies commercial as well as
military entities and advances in semiconductor and Radio Frequency Integrated
Circuit (RFIC) technology, though first implemented in military systems
eventually transitioned to commercial product lines. Examples being Global
Positioning System use and the evolution of the Internet and cellular phones.
1. U.S. Frequency Allocation
Chart as of October 2003. www.ntia.doc.gov/legacy/osmhome/Chp04Chart.pdf
2. Kopp, B.A., Borkowski, M.,
and Jerinic, G. “Transmit/Receive Modules.” IEEE Transactions on Microwave
Theory and Techniques, March 2002, Vol. 50, Issue 3, pp. 827-834. http://ieeexplore.ieee.org/document/989966/
3. Katz, A. & Franco, M.
“GaN Comes of Age.” IEEE Microwave Magazine (Supplement) December 2010, Vol.
11, Issue 7, pp. S24-S34. http://ieeexplore.ieee.org/document/5590355/
4. Campbell, C.F. et al. “GaN
Takes the Lead.” IEEE Microwave Magazine, Sept./Oct. 2012, Vol 13, Issue 6, pp.
5. Felbinger, J.G. et al.
“Comparison of GaN HEMTs on Diamond and SiC Substrates.” IEEE Electron Devices
Letters, 28 Nov. 2007, pp. 948-950. http://ieeexplore.ieee.org/document/4367547/
6. MIL-STD-704F, DEPARTMENT
OF DEFENSE INTERFACE STANDARD: AIRCRAFT ELECTRIC POWER CHARACTERISTICS (12 MAR
7. MIL-STD-461F, DEPARTMENT
OF DEFENSE INTERFACE STANDARD: REQUIREMENTS FOR THE CONTROL OF ELECTROMAGNETIC
INTERFERENCE CHARACTERISTICS OF SUBSYSTEMS AND EQUIPMENT (10 DEC 2007). http://everyspec.com/MIL-STD/MIL-STD-0300-0499/MIL-STD-461F_19035/
8. MIL-STD-810G (w/
CHANGE-1), DEPARTMENT OF DEFENSE TEST METHOD STANDARD: ENVIRONMENTAL
ENGINEERING CONSIDERATIONS AND LABORATORY TESTS (15-APR-2014) (LARGE FILE - 66
KEYWORDS: Gallium Nitride;
Silicon Carbide; Diamond Substrate; GaN on Diamond; Transmit/receive Modules;
Radio Frequency Integrated Circuits