Modem Translator for Future Time Triggered Ethernet Network Digital Avionics/Sensors Optical On-Board Backbones
Navy SBIR 2018.2 - Topic N182-106
NAVAIR - Ms. Donna Attick - firstname.lastname@example.org
Opens: May 22, 2018 - Closes: June 20, 2018 (8:00 PM ET)
TECHNOLOGY AREA(S): Air Platform, Electronics, Weapons
ACQUISITION PROGRAM: NAE
Chief Technology Office
The technology within this
topic is restricted under the International Traffic in Arms Regulation (ITAR),
22 CFR Parts 120-130, which controls the export and import of defense-related
material and services, including export of sensitive technical data, or the
Export Administration Regulation (EAR), 15 CFR Parts 730-774, which controls
dual use items. Offerors must disclose any proposed use of foreign nationals
(FNs), their country(ies) of origin, the type of visa or work permit possessed,
and the statement of work (SOW) tasks intended for accomplishment by the FN(s)
in accordance with section 3.5 of the Announcement. Offerors are advised
foreign nationals proposed to perform on this topic may be restricted due to
the technical data under US Export Control Laws.
OBJECTIVE: Develop and test a
modem translator that supports both low Time-Triggered Ethernet speeds of 10 to
100 megabits per second, and can be extended to handle next-generation
ultra-high bandwidth ranges of 100 to 400 gigabits per second (100G/400G).
DESCRIPTION: Fiber optic
networks in aircraft have become pervasive. Aviation performance and durability
requirements, such as on and off platform shock, vibration, thermodynamic,
atmospheric, and fleet maintenance, make this technology challenging to produce
and deploy. Research is needed to develop innovative flight-line and
high-performance computer networking test and verification (T&V) modems for
both legacy and next-generation Time Triggered Ethernet baud rates using
commercial off-the-shelf (COTS) fiber optic transceivers and logic circuits.
PHASE I: Determine the
feasibility risks associated with developing a flight-line test and
verification network test modem that can handle (non-intrusive) both copper
and/or multi-mode optical fiber cable plants supporting low speed rates of 10
to 100 megabits per second using TTE traffic. A growth capability must be
included in the design to handle high speed rates of 100 to 400 gigabits per second.
The high-speed growth design should be based on 50-micron multi-mode optical
fiber links having a bit error rate less than 10-12. Develop a Phase II plan.
PHASE II: Further the
development of, fabricate and test the prototype T&V modem based on Phase I
work. Perform environmental tests [Refs 7–8] to verify durability and
performance. Demonstrate that the proposed package design is able to be
interfaced with electrical and/or optical interfaces. Characterize the
high-speed prototype 100G/400G per second package designs in a
Government-designated high-performance computing network testbed.
PHASE III DUAL USE
APPLICATIONS: Perform extensive TTE network performance testing. If the
performance testing fulfills the established industry commercial standards
(e.g., computer networking metrics) then proceed to include flight-line
reliability and durability testing. Transition the demonstrated technology to
Naval aviation platforms and interested commercial applications. The technology
would find application in commercial systems such as driver-less car markets
that demand high performance time precision network traffic, on-board data
centers such as commercial unmanned aerial vehicles (UAVs), and fiber optic
local area networks and telecommunications.
1. Beranek, M.W. “Fiber optic
interconnect and optoelectronic packaging challenges for future generation
avionics”. Proceedings of SPIE, vol. 6478, January, 2007. https://www.spiedigitallibrary.org/conference-proceedings-of-spie/6478/647809/Fiber-optic-interconnect-and-optoelectronic-packaging-challenges-for-future-generation/10.1117/12.709761.short?SSO=1
2. Chan, E.Y, Le, Q.N. &
Beranek, M.W. “High performance, low-cost chip-on-board (COB) FDDI transmitter
and receiver for avionics applications”. IEEE Electronic Components and
Technology Conference, June, 1998. http://ieeexplore.ieee.org/document/678726/
3. Beranek, M. &
Copeland, E. “Accelerating fiber optic and photonic device technology
transition via pre-qualification reliability and packaging durability testing”.
IEEE Avionics and Vehicle Fiber-Optics and Photonics Conference, Santa Barbara,
CA, November, 2015. http://ieeexplore.ieee.org/document/7356630/
Performance Specification: Hybrid Microcircuits, General Specification for,
Defense Logistics Agency, Columbus, Ohio. http://everyspec.com/MIL-PRF/MIL-PRF-030000-79999/MIL-PRF-38534J_52190/
5. SAE AS6802. Time-Triggered
Ethernet. Reaffirmed 11-09-2016. http://standards.sae.org/as6802/
6. Dikhaminjia, N., He, J.,
Tsiklauri, M., Drewniak, J., Fan, J., Chada, A., Mutnury, N. & Achkir, B.
“PAM4 signaling considerations for high speed serial links”, IEEE International
Symposium on Electromagnetic Compatibility (EMC), 2016. http://ieeexplore.ieee.org/document/7571771/
Environmental Engineering Considerations and Laboratory Tests. http://everyspec.com/MIL-STD/MIL-STD-0800-0899/MIL-STD-810G_12306/
8. MIL-STD-1678/1, Fiber Optic Cabling Systems Requirements and Measurements.
KEYWORDS: Time Triggered
Ethernet; High Speed Digital Fiber Optic Networks; 100G-400Gbps; Packaging;
Avionics; Mission Sensors