Cooling System for Laser Enclosure
AREA(S): Electronics, Weapons
PROGRAM: PMA 299 (ASW) H-60 Helicopter Program
Develop an efficient laser cooling system for heat removal from a laser
Most Naval platforms use a combination of imaging systems with laser emitters
for the purpose of real-time active imaging, laser designation, and range
finding capabilities. Due to the high output energy requirements from the
lasers, there is a need for the development of an additional cooling system for
laser enclosures to supplement the conventional closed liquid loop cooler. No
interfacing between the primary and secondary cooling systems is necessary.
This requirement is mainly driven by the fact that laser head can heat up
faster than the rest of the system and ambient temperature of -40°C to 55°C,
can be much higher than the internal temperature of the laser enclosure.
The system should be designed to be rugged, compact and lightweight enough to
be used in Naval aircraft, both fixed and rotatory wing platforms. It is
therefore the goal of this program to seek the development of the cooling
system for a power-scalable laser system solution that will meet the size,
weight, performance and reliability requirements below while considering
component costs for future production of the system. The proposer should
consider this development as the innovative advancement and combination of
laser and supporting technologies towards the goals stated below; and their
design should focus mainly on cooling the laser head; however, the cooling
system must be designed such that it cools down the laser head and minimizes
the heat throughout the entire system as specified by the internal temperature
The performance objectives of the cooling system are;
1. Maintain consistent internal temperature of 25°C with the laser head being
cooler than the overall internal temperature at approximately 10°C.
2. Thermal management largely driven by an internal temperature limit of 65°F
and the fact that ambient temperature may be significantly higher than the
required internal temperature.
3. The cooling system must dissipate heat in the order of ~20KJ.
4. Ability to be ruggedized and packaged to withstand the shock, vibration,
pressure, temperature, humidity, electrical power conditions, etc. encountered
in a system built for airborne use per MIL-STD-810G
5. Weight of approximately 125 pounds.
6. Physical size of 16 x 15 x102 inches.
7. Reliability: mean time between equipment failure of 300 operating hours.
8. Full Rate Production Cost: Threshold <$50,000; Objective <$15,000
(based on 1000 units).
I: Define and develop a concept for a viable and robust cooling system solution
that meets or exceeds the requirements specified in the description. Identify
technological and reliability challenges of the design approach, and propose
viable risk mitigation strategies. The Phase I effort will include plans to
develop a prototype under Phase II.
II: Design, fabricate, and demonstrate a laser system prototype based on the
design from Phase I. Test and fully characterize the system prototype.
III DUAL USE APPLICATIONS: Using Phase II test results and Navy feedback,
finalize the design, fabricate a ruggedized laser system solution, and assist
with efforts to obtain certification for flight on a NAVAIR R&D aircraft.
High-power, pulsed lasers have applications in manufacturing and lithography.
An efficient cooling system for the lasers used for drilling or etching would
help stabilize the laser beam divergence and increase the accuracy of the
Tuckerman, D. B. et al. “High Performance Heat Sinking for VLSI.” IEEE Electron
Device Letters, May 1981, Vol. 2, Issue 5, pp. 126-129. http://ieeexplore.ieee.org/document/1481851/
Bland, T. J. et al. “A Compact High Intensity Cooler (CHIC).” SAE Technical
Paper 831127, 13th Intersociety Conference on Environmental Systems, San
Francisco, Calif., July 11-13, 1983. https://www.researchgate.net/publication/260903319_A_compact_high_intensity_cooler_CHIC
MIL-STD-810G, DEPARTMENT OF DEFENSE TEST METHOD STANDARD: ENVIRONMENTAL
ENGINEERING CONSIDERATIONS AND LABORATORY TESTS (31 OCT 2008). http://everyspec.com/MIL-STD/MIL-STD-0800-0899/MIL-STD-810G_12306/
KEYWORDS: Cooling System; Heat Control;
Temperature Control; Heat Stability; Designator; Target Marker
** TOPIC NOTICE **
These Navy Topics are part of the overall DoD 2018.A STTR BAA. The DoD issued its 2018.A BAA SBIR pre-release on November 29, 2017, which opens to receive proposals on January 8, 2018, and closes February 7, 2018 at 8:00 PM ET.
Between November 29, 2017 and January 7, 2018 you may talk directly with the Topic Authors (TPOC) to ask technical questions about the topics. During these dates, their contact information is listed above. For reasons of competitive fairness, direct communication between proposers and topic authors is not allowed starting January 8, 2018 when DoD begins accepting proposals for this BAA.
However, until January 24, 2018, proposers may still submit written questions about solicitation topics through the DoD's SBIR/STTR Interactive Topic Information System (SITIS), in which the questioner and respondent remain anonymous and all questions and answers are posted electronically for general viewing until the solicitation closes. All proposers are advised to monitor SITIS during the Open BAA period for questions and answers and other significant information relevant to their SBIR/STTR topics of interest.
Topics Search Engine: Visit the DoD Topic Search Tool at sbir.defensebusiness.org/topics/ to find topics by keyword across all DoD Components participating in this BAA.
Proposal Submission: All SBIR/STTR Proposals must be submitted electronically through the DoD SBIR/STTR Electronic Submission Website, as described in the Proposal Preparation and Submission of Proposal sections of the program Announcement.
Help: If you have general questions about DoD SBIR program, please contact the DoD SBIR/STTR Help Desk at 800-348-0787 or via email at firstname.lastname@example.org